ESAComp v4.7 for PC Windows

Description

HyperWorks ESAComp 4.7.018 has a vast set of analysis capabilities for solid/sandwich laminates and for micromechanical analyses. It further includes analysis tools for structural elements: flat and curved panels, stiffened panels, beams and columns, cylinders, bonded and mechanical joints.

This program is a stand-alone software tool, but thanks to its ability to interface with widely used finite element software packages it fits seamlessly into design processes.

The ESAComp 4.7.018 Data Bank includes data for a wide selection of composite materials and material systems. User and company specific material libraries can be stored in the database, as well as data related to design studies. Besides materials, the ESAComp database includes ESAComp objects: fibers/matrix materials, plies, laminates, beams, panels, cylinders, bonded and mechanical joints, loads, and boundary conditions.

Further, it offers through-the-thickness plots, which illustrate the stresses, strains or reserve factors (margins of safety and inverse reserve factors, respectively), Loads and laminates can be derived from the imported load case to benefit from ESAComp’s whole set of tools for design improvement.

Overview of Program Key Features

• Ply engineering constants and thermal/moisture expansion coefficients based on the mechanics of materials approach, Halpin-Tsai, or user specified micromechanics models
• Ply properties as a function of volume/weight fraction or ply directionality of bi-directional plies
• Analyses for constitutive and thermal/moisture expansion behavior of plies
• Parameterized “theta-laminates” – orientation of ±θ-layers as a variable
• Parameterized “p-laminates” – proportional amount of selected layers as a variable
• Laminate strength in principal loading conditions
• Load response – laminate and layer level response including out-of-plane shear stresses, effects due to thermal/moisture loads